OE Hybrid Packaging Process
OE Hybrid package for 100G/λ or higher
RF Design
We take RF simulation to guide our
PCB/submount design. Accurate simulation
guarantees product’s characteristics and reliability.
Thermal Design
By board level thermal simulation and test,
we evaluate thermal performance of different zones,
and ensure all components are working at acceptable conditions.
Optical Design
Optical simulation helps to achieve a large
tolerance optical overall scheme and
improves products’ consistency.
